Author:
Yeh Jun-Hsien,Tsai Tsung-Nan
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference29 articles.
1. Microstructural study of copper free air balls in thermosonic wire bonding;Hang;Microelectron Eng,2008
2. Wang MC, Hsieh ZY, Huang KS, Liu CH, Lin CR. Analysis of promising copper wire bonding in assembly consideration. Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT. Taipei; 2009: p. 108–11.
3. The Swedish Institute of Production Engineering Research. The Nordic electronics packaging guideline; 2000. .
4. Critical study of thermosonic copper ball bonding;Srikanth;Thin Solid Films,2004
5. Cratering response method to study the effect of ultrasonic energy on Cu-wire bonding quality;Rongen;Microelectron Reliab,2011
Cited by
23 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献