Integrating copper at the nanometer length scale with Sn–3·5Ag solder to develop high performance nanocomposites
Author:
Publisher
Informa UK Limited
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Link
http://www.tandfonline.com/doi/pdf/10.1179/174328408X378582
Reference47 articles.
1. Lead-free Solders in Microelectronics
2. Lead (Pb)-free solders for electronic packaging
3. Intermetallic growth and mechanical behavior of low and high melting temperature solder alloys
4. Environmental concerns and materials issues in manufactured solder joints
5. Effects of cooling rate on the microstructure and tensile behavior of a Sn-3.5wt.%Ag solder
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1. Microstructure, mechanical properties and corrosion analysis of Sn–0.7Cu + Ga solders joints developed using green concentrated solar energy soldering method;Journal of Materials Science: Materials in Electronics;2021-07-28
2. Effect of nano Al2O3 additions on the interfacial behavior and mechanical properties of eutectic Sn-9Zn solder on low temperature wetting and soldering of 6061 aluminum alloys;Journal of Alloys and Compounds;2017-02
3. Microstructure and mechanical properties of Sn-9Zn-xAl 2 O 3 nanoparticles (x=0–1) lead-free solder alloy: First-principles calculation and experimental research;Materials Science and Engineering: A;2016-12
4. Development and Characterization of Nano-Composite Solder;Lead-Free Solders: Materials Reliability for Electronics;2012-03-15
5. Reinforcements at nanometer length scale and the electrical resistivity of lead-free solders;Journal of Alloys and Compounds;2009-06
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