Microstructure and mechanical properties of Sn-9Zn-xAl 2 O 3 nanoparticles (x=0–1) lead-free solder alloy: First-principles calculation and experimental research-Reference-Cited by-同舟云学术

Microstructure and mechanical properties of Sn-9Zn-xAl 2 O 3 nanoparticles (x=0–1) lead-free solder alloy: First-principles calculation and experimental research

Published:2016-12 Issue: Volume:678 Page:252-259
ISSN:0921-5093
Container-title:Materials Science and Engineering: A
language:en
Short-container-title:Materials Science and Engineering: A

Author:

Xing Wen-qing,Yu Xin-ye,Li Heng,Ma Le,Zuo Wei,Dong Peng,Wang Wen-xian,Ding Min

Funder

National Natural Science Foundation of China

Natural Science Foundation of Shanxi Province

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference31 articles.

1. Reliability testing of WLCSP lead-free solder joints;Chiang;J. Electron. Mater.,2006

2. Development of a Sn-Ag-Cu solder reinforced with Ni-coated carbon nanotubes;Han;J. Mater. Sci. Mater. Electron.,2011

3. Microstructure and mechanical properties of Pb-free solder alloys for low-cost electronic assembly: a review;Glazer;J. Electron. Mater.,1994

4. Effects of cerium on Sn-Ag-Cu alloys based on finite element simulation and experiments;Zhang;J. Rare Earths,2009

5. Effects of phosphorus element on the comprehensive properties of Sn-Cu lead-free solder;Li;J. Alloy. Compd.,2010

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