Interfacial microstructure, shear strength and electrical conductivity of Sn–3˙5Ag–0˙5In/Cu lead free soldered joints
Author:
Publisher
Informa UK Limited
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Link
http://www.tandfonline.com/doi/pdf/10.1179/175355507X236632
Reference14 articles.
1. Reliability issues for flip-chip packages
2. Studies of the mechanical and electrical properties of lead-free solder joints
3. IMC Growth and Shear Strength of Sn-Ag-Bi-In/Au/Ni/Cu BGA Joints During Aging
4. Evaluation of creep behavior of near-eutectic Sn–Ag solders containing small amount of alloy additions
5. Progress in the design of new lead-free solder alloys
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1. A Comparative Study on the Influence of SAC305 Lead‐Free Solder Sandwiched by Sn on the Micromechanical and Electrical Properties of the Joints;Advanced Engineering Materials;2021-08-26
2. Retardation Effect of Tin Multilayer on Sn-3.0Ag-0.5Cu (SAC305)-Based Solder Joint Interface;Journal of Materials Engineering and Performance;2020-03-17
3. Introductory Chapter: Overview of Pb-Free Solders and Effect of Multilayered Thin Film of Sn on the Lead-Free Solder Joint Interface;Lead Free Solders;2019-10-02
4. Effect of Mn on Sn–Ag–Cu ternary lead free solder alloy–Cu assembly: a comparative study;Materials Science and Technology;2010-05
5. Aging Characteristics of Sn-Ag Eutectic Solder Alloy with the Addition of Cu, In, and Mn;Metallurgical and Materials Transactions A;2009-08-19
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