Introductory Chapter: Overview of Pb-Free Solders and Effect of Multilayered Thin Film of Sn on the Lead-Free Solder Joint Interface
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IntechOpen
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http://www.intechopen.com/download/pdf/67564
Reference27 articles.
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4. Kar A, Ghosh M, Majumdar BS, Ghosh RN, Ray AK. Interfacial microstructure, shear strength and electrical conductivity of Sn-3.5Ag-0.5In/Cu lead free soldered joints. Materials Technology. 2007;22(3):161-165
5. Tu K-N. Copper–Tin Reactions in Bulk Samples. In: Solder Joint Technology, Springer Series in Materials Science Vol. 117. New York: Springer; 2007. pp. 37-71
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