Reliability issues for flip-chip packages-Reference-Cited by-同舟云学术

Reliability issues for flip-chip packages

Published:2004-05 Issue:5 Volume:44 Page:719-737
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Ho Paul S.,Wang Guotao,Ding Min,Zhao Jie-Hua,Dai Xiang

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference37 articles.

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2. Solid Logic Technology: Versatile, High-Performance Microelectronics

3. Koopman NG, Reiley TC, Totta PA. In: Tummala RR, Rymaszewski EJ (Eds.), Microelectronics Packaging Handbook. Van Norstrand Reinhold, NY, 1989 (Chapter 6)

4. Wu TY, Tsukada Y, Chen WT. In: Proc Electronic Comp And Techno Conf, 1996. p. 524

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