Thermal fatigue properties and grain boundary character distribution in Sn–x Ag–0˙5Cu (x = 1, 1˙2 and 3) lead free solder interconnects
Author:
Publisher
Informa UK Limited
Subject
Condensed Matter Physics,General Materials Science
Link
http://www.tandfonline.com/doi/pdf/10.1179/174329308X271788
Reference26 articles.
1. The mechanical behavior of interconnect materials for electronic packaging
2. Creep, stress relaxation, and plastic deformation in Sn-Ag and Sn-Zn eutectic solders
3. Effect of silver content on thermal fatigue life of Sn-xAg-0.5Cu flip-chip interconnects
4. Improvement on Thermal Fatigue Properties of Sn-1.2Ag-0.5Cu Flip Chip Interconnects by Nickel Addition
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1. Effect of Ag content on microstructure and mechanical properties of Sn−xAg−0.5Cu solder joints under rapid thermal shock;Transactions of Nonferrous Metals Society of China;2024-06
2. Taguchi Optimization of Wetting, Thermal and Mechanical Properties of Sn-1.0wt.%Ag-0.5wt.%Cu Alloys Modified with Bi and Sb;Materials;2024-06-01
3. Investigation of Microstructure and Mechanical Properties of SAC105 Solders with Sb, In, Ni, and Bi Additions;Materials;2023-05-30
4. A method to determine the slip systems in BGA lead-free solder joints during thermal fatigue;Journal of Materials Science: Materials in Electronics;2018-02-15
5. Thermal Fatigue Behavior of Sn–Ag/Cu Solder Joints;Springer Theses;2015-10-30
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