Funder
National Natural Science Foundation of China
Beijing Natural Science Foundation
Natural Science Foundation of Beijing Municipality
Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference30 articles.
1. J.Q. Chen, J.D. Guo, K.L. Liu, J.K. Shang, Dependence of electromigration damage on Sn grain orientation in Sn-Ag-Cu solder joints. J. Appl. Phys. 114, 153509 (2013)
2. H.T. Ma, W.D. Xie, G. Subbarayan, Effects of multiple reworks on the accelerated thermal cycling and shock performance of lead-free BGA assemblies. IEEE Trans. Comp. Packag. Manuf. 2, 1824–1831 (2012)
3. J. Sitek, M. Koscielski, K. Bukat, M. Jakubowska, W. Niedzwiedz, A. Mlozniak, Influence of silver nanopowders addition to the SAC solder paste on thermal and mechanical fatigue properties of solder joints. Prz Elektrotechniczn. 88, 79–82 (2012)
4. A. Qasaimeh, S. Hamasha, Y. Jaradat, P. Borgesen, Damage evolution in lead free solder joints in isothermal fatigue. J. Electron. Packag. 137, 021012 (2015)
5. A. Shirazi, H. Lu, A. Varvani-Farahani, Fatigue behaviour of lead-free solder interconnections in life prediction of trilayer structures subjected to thermal cycling. in Proceedings of the Asme 10th International Manufacturing Science and Engineering Conference, vol 1 (2015)
Cited by
7 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献