Electromigration-Aware Interconnect Design-Reference-Cited by-同舟云学术

Electromigration-Aware Interconnect Design

Published:2019-04-04 Issue: Volume: Page:
ISSN:
Container-title:Proceedings of the 2019 International Symposium on Physical Design
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Author:

Sapatnekar Sachin S.¹

Affiliation:

1. University of Minnesota, Minneapolis, MN, USA

Funder

NSF

Defense Advanced Research Projects Agency

Publisher

ACM

Link

https://dl.acm.org/doi/pdf/10.1145/3299902.3313156

Reference38 articles.

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4. Clocking design and analysis for a 600-MHz alpha microprocessor;Bailey D.W.;IEEE J. Solid-St. Circ.,1998

5. Electromigration failure modes in aluminum metallization for semiconductor devices

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