A Novel Semi-Analytical Approach for Fast Electromigration Stress Analysis in Multi-Segment Interconnects
Author:
Affiliation:
1. University of Thessaly, Volos, Greece
2. University of Minnesota
Publisher
ACM
Link
https://dl.acm.org/doi/pdf/10.1145/3508352.3549476
Reference24 articles.
1. Electromigration and its impact on physical design in future technologies
2. Microstructure modulation for resistance reduction in copper interconnects
3. Fundamentals of Electromigration-Aware Integrated Circuit Design
4. Electromigration in thin aluminum films on titanium nitride
5. Electromigration—A brief survey and some recent results
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1. An Electromigration-Aware Wire Sizing Methodology via Particle Swarm Optimization;Proceedings of the Great Lakes Symposium on VLSI 2024;2024-06-12
2. A Graph-Learning-Driven Prediction Method for Combined Electromigration and Thermomigration Stress on Multi-Segment Interconnects;2024 Design, Automation & Test in Europe Conference & Exhibition (DATE);2024-03-25
3. An Efficient Security Closure Methodology for EM-based Attacks on Power Grid Structures;2023 IEEE International Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology Systems (DFT);2023-10-03
4. PROTON – A Python Framework for Physics-Based Electromigration Assessment on Contemporary VLSI Power Grids;2023 19th International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD);2023-07-03
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