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Cross-Layer Resilience

  • Published:2019-06-02 Issue: Volume: Page:
  • ISSN:
  • Container-title:Proceedings of the 56th Annual Design Automation Conference 2019
  • language:
  • Short-container-title:

Author:

Cheng Eric1,Daniel-Mueller-Gritschneder 2,Abraham Jacob3,Bose Pradip4,Buyuktosunoglu Alper4,Chen Deming5,Cho Hyungmin6,Li Yanjing7,Sharif Uzair2,Skadron Kevin8,Stan Mircea8,Schlichtmann Ulf2,Mitra Subhasish1

Affiliation:

1. Stanford University

2. Technical University of Munich

3. University of Texas at Austin

4. IBM Research

5. University of Illinois at Urbana-Champaign

6. Hongik University

7. University of Chicago

8. University of Virginia

Funder

Defense Advanced Research Projects Agency

Semiconductor Research Corporation

National Science Foundation

Deutsche Forschungsgemeinschaft

Defense Threat Reduction Agency

Publisher

ACM

Cited by 5 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Gem5-MARVEL: Microarchitecture-Level Resilience Analysis of Heterogeneous SoC Architectures;2024 IEEE International Symposium on High-Performance Computer Architecture (HPCA);2024-03-02

2. Cross-layer Bayesian Network for UAV Health Monitoring;2024 2nd International Conference on Unmanned Vehicle Systems-Oman (UVS);2024-02-12

3. Resiliency in Digital Processing Systems;2023 IEEE 33rd International Conference on Microelectronics (MIEL);2023-10-16

4. Counterattacking Cyber Threats: A Framework for the Future of Cybersecurity;Sustainability;2023-09-06

5. Testability and Dependability of AI Hardware: Survey, Trends, Challenges, and Perspectives;IEEE Design & Test;2023-04
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