Testability and Dependability of AI Hardware: Survey, Trends, Challenges, and Perspectives-Reference-Cited by-同舟云学术

Testability and Dependability of AI Hardware: Survey, Trends, Challenges, and Perspectives

Published:2023-04 Issue:2 Volume:40 Page:8-58
ISSN:2168-2356
Container-title:IEEE Design & Test
language:
Short-container-title:IEEE Des. Test

Author:

Su Fei¹^ORCID,Liu Chunsheng²^ORCID,Stratigopoulos Haralampos-G.³^ORCID

Affiliation:

1. Intel Corporation, Folsom, CA, USA

2. Alibaba Inc., Sunnyvale, CA, USA

3. Sorbonne Université, CNRS, LIP6 Laboratory, Paris, France

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Hardware and Architecture,Software

Link

http://xplorestaging.ieee.org/ielx7/6221038/10066123/10032608.pdf?arnumber=10032608

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