Affiliation:
1. Texas A&M University, TX
Abstract
Supply current measurement-based test is a valuable defect-based test method for semiconductor chips. Both static leakage current (I
DDQ
) and transient current (I
DDT
) based tests have the capability of detecting unique defects that improve the fault detection capacity of a test suite. Collectively these test methods are known as I
DDX
tests. However, due to advances in the semiconductor manufacturing process, the future of these test methods is uncertain. This paper presents a survey of the research reported in the literature to extend the use of I
DDX
tests to deep sub-micron (DSM) technologies.
Publisher
Association for Computing Machinery (ACM)
Subject
Electrical and Electronic Engineering,Computer Graphics and Computer-Aided Design,Computer Science Applications
Cited by
27 articles.
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