Multi-physics-based FEM analysis for post-voiding analysis of electromigration failure effects-Reference-Cited by-同舟云学术

Multi-physics-based FEM analysis for post-voiding analysis of electromigration failure effects

Published:2018-11-05 Issue: Volume: Page:
ISSN:
Container-title:Proceedings of the International Conference on Computer-Aided Design
language:
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Author:

Zhao Hengyang¹,Tan Sheldon¹

Affiliation:

1. University of California

Publisher

ACM

Link

https://dl.acm.org/doi/pdf/10.1145/3240765.3243486

Reference28 articles.

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2. Estimating and optimizing BTI aging effects

3. T. Bergman A. Lavine F.P. Incropera and D.P. DeWitt. 2011. Fundamentals of Heat and Mass Transfer. John Wiley & Son. T. Bergman A. Lavine F.P. Incropera and D.P. DeWitt. 2011. Fundamentals of Heat and Mass Transfer . John Wiley & Son.

4. A phase field model for failure in interconnect lines due to coupled diffusion mechanisms

5. Electromigration—A brief survey and some recent results

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