Temperature‐dependent fatigue modelling of a novel Ni, Bi and Sb containing Sn‐3.8Ag‐0.7Cu lead‐free solder alloy-Reference-Cited by-同舟云学术

Temperature‐dependent fatigue modelling of a novel Ni, Bi and Sb containing Sn‐3.8Ag‐0.7Cu lead‐free solder alloy

Author:

Tao Q.B.¹^ORCID,Benabou L.²^ORCID,Le Van Nhat²,Nguyen Ngoc Anh Thi³,Nguyen‐Xuan Hung⁴⁵

Affiliation:

1. Faculty of Mechanical Engineering The University of Danang ‐ University of Science and Technology 54 Nguyen Luong Bang Da nang Vietnam

2. LISV, Université de Versailles Saint‐Quentin‐en‐Yvelines Université Paris‐Saclay Versailles France

3. Faculty of Information Technology The University of Danang ‐ University of Science and Education 459 Ton Duc Thang Da Nang Vietnam

4. CIRTech Institute Ho Chi Minh City University of Technology (HUTECH) Ho Chi Minh City Viet Nam

5. Department of Architectural Engineering Sejong University 209 Neungdong‐ro Gwangjin‐gu Seoul 05006 Republic of Korea

Funder

National Foundation for Science and Technology Development

Publisher

Wiley

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Link

Reference35 articles.

1. https://ec.europa.eu/environment/waste/weee/pdf/rpa_study.pdf

4. Improved reliability and mechanical performance of Ag microalloyed Sn58Bi solder alloys;Ren G;Metallomics,2019

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