Author:
Zhou D.,Haseeb A.S.M.A.,Andriyana A.
Funder
Collaborative Research in Engineering Science and Technology Centre
Universiti Malaya
Universiti Malaya Institut Pengurusan Penyelidikan dan Pemantauan
Subject
Materials Chemistry,Mechanics of Materials,General Materials Science
Reference49 articles.
1. Ganesan, Sanka, and Michael G. Pecht, eds. Lead-free electronics. John Wiley & Sons, 2006.
2. Ma, Hongtao, et al. Reliability of the aging lead free solder joint. In: Proceedings of the 56th Electronic Components and Technology Conference 2006. IEEE, 2006. https://doi.org/10.1109/ECTC.2006.1645757.
3. Handbook of Lead-Free Solder Technology for Microelectronic Assemblies;Puttlitz,2004
4. Effect of Ni and Sb additions and testing conditions on the mechanical properties and microstructures of lead-free solder joints;Tao;Mater. Sci. Eng.: A,2016
5. Effect of alloying elements on properties and microstructures of SnAgCu solders;Gao;Microelectron. Eng.,2010
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