Reliability of the Aging Lead Free Solder Joint-Reference-Cited by-同舟云学术

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Reliability of the Aging Lead Free Solder Joint

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Container-title:56th Electronic Components and Technology Conference 2006
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Author:

Hongtao Ma ,Suhling J.C.,Lall P.,Bozack M.J.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/10951/34490/01645757.pdf?arnumber=1645757

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Correlation of Mechanical and Microstructural Evolutions in Lead Free Solders Subjected to Various Thermal Exposures;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

2. Mechanical Characterization and Modeling of iSAC Lead-Free Solder;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

3. Mechanical performance of advanced multicomponent lead-free solder alloy under thermal aging;Materials Today Communications;2022-12

4. The Effect of Isothermal Ageing Treatment on Different PCB Surface Finishes: Simulation and Experimental;Recent Progress in Lead-Free Solder Technology;2022

5. Effective Solder for Improved Thermo-Mechanical Reliability of Solder Joints in a Ball Grid Array (BGA) Soldered on Printed Circuit Board (PCB);Journal of Electronic Materials;2020-11-05

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