Plasma‐resistance evaluation of yttrium oxyfluoride coating prepared by aerosol deposition method-Reference-Cited by-同舟云学术

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Plasma‐resistance evaluation of yttrium oxyfluoride coating prepared by aerosol deposition method

Published:2021-09-13 Issue:1 Volume:19 Page:375-382
ISSN:1546-542X
Container-title:International Journal of Applied Ceramic Technology
language:en
Short-container-title:Int J Appl Ceram Technol

Author:

Ashizawa Hiroaki¹²^ORCID,Yoshida Katsumi³

Affiliation:

1. TOTO Ltd. Chigasaki Japan

2. Department of Materials Science and Engineering School of Materials and Chemical Technology Tokyo Institute of Technology Tokyo Japan

3. Laboratory for Zero‐Carbon Energy Institute of Innovative Research Tokyo Institute of Technology Tokyo Japan

Publisher

Wiley

Subject

Materials Chemistry,Marketing,Condensed Matter Physics,Ceramics and Composites

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1111/ijac.13880

Reference37 articles.

1. Fundamentals of Semiconductor Manufacturing and Process Control

2. Reduction of Particle Contamination in Plasma-Etching Equipment by Dehydration of Chamber Wall

3. Characteristics and mechanism of etch process sensitivity to chamber surface condition

4. Effect of chamber wall conditions on Cl and Cl2 concentrations in an inductively coupled plasma reactor

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1. The Etching Behaviour and Fluorine-Based-Plasma Resistance of YOF Coatings Deposited by Atmospheric Plasma Spraying;Coatings;2024-08-26

2. Effect of O2/Ar ratio on the microstructure and tribological properties of Y2O3 films by multi-arc ion plating;Ceramics International;2024-08

3. Effect of Interlayer on Flatness and Adhesion of Aerosol-Deposited Yttrium Oxide Coating;Materials;2024-07-17

4. Optimization of Ion Beam-Assisted Deposition Process for Y<sub>2</sub>O<sub>3</sub> Film to Enhance Plasma Resistance;Korean Journal of Metals and Materials;2024-05-05

5. Effect of porosity on etching rate and crater-like microstructure of sintered Al2O3, Y2O3, and YAG ceramics in plasma etching;Ceramics International;2024-05

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