The Etching Behaviour and Fluorine-Based-Plasma Resistance of YOF Coatings Deposited by Atmospheric Plasma Spraying

Author:

Tang Zaifeng12,Wang Yuwei2,Ang Kaiqu2,Xu Jin2,Meng Hua2,Chen Hongli3,Wei Yuxuan3,Shi Ying1,Wang Linjun145

Affiliation:

1. School of Materials Science and Engineering, Shanghai University, 333 Nanchen Road, Shanghai 200444, China

2. Shanghai Huali Integrated Circuit Corporation, 6 Liangteng Road, Pudong New Area, Shanghai 201314, China

3. Chongqing Genori Technology Co., Ltd., No.66, Sendi Avenue, Xipeng Town, Jiulongpo District, Chongqing 401326, China

4. Shanghai Collaborative Innovation Center of Intelligent Sensing Chip Technology, Shanghai 201800, China

5. Zhejiang Institute of Advanced Materials, Shanghai University, Jiashan 314113, China

Abstract

There is a high demand for plasma-resistant coatings that prevent the corrosion of the internal ceramic components of plasma etching equipment, thereby reducing particle contamination and process drift. Yttrium oxyfluoride (YOF) coatings were prepared using atmospheric plasma spraying (APS) with commercially available YOF/YF3 powder mixtures; namely YOF 3%, YOF 6%, and YOF 9%. The etching behaviour of YOF and yttrium oxide (Y2O3) coatings was investigated using an inductively coupled plasma consisting of NF3/He. X-ray photoelectron spectroscopy (XPS) showed that the YOF 6% coating had the thickest fluorinated layer. The scanning electron microscope (SEM) examination revealed that the YOF 6% coating showed exceptional resistance to erosion and generated a reduced quantity of contaminated particles in comparison to Y2O3. Consequently, it is more suitable as a protective material for the inner wall of reactors. The YOF coatings exhibit excellent stability and high resistance to erosion, indicating their appropriateness for use in the semiconductor industry.

Funder

National Key R & D Program of China

Publisher

MDPI AG

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