Copper‐based nanoparticles for biopolymer‐based functional films in food packaging applications

Abstract

AbstractThis review summarizes the latest developments in the design, fabrication, and application of various Cu‐based nanofillers to prepare biopolymer‐based functional packaging films, focusing on the effects of inorganic nanoparticles on the optical, mechanical, gas barrier properties, moisture sensitivity, and functional properties of the films. In addition, the potential application of Cu‐based nanoparticle‐added biopolymer films for fresh food preservation and the effect of nanoparticle migration on food safety were discussed. The incorporation of Cu‐based nanoparticles improved the film properties with enhanced functional performance. Cu‐based nanoparticles such as copper oxide, copper sulfide, copper ions, and copper alloys affect biopolymer‐based films differently. The properties of composite films containing Cu‐based nanoparticles depend on the concentration of the filler, the state of dispersion, and the interaction of the nanoparticles with the biopolymer matrix in the film. The composite film filled with Cu‐based nanoparticles effectively extended the shelf life by maintaining the quality of various fresh foods and securing safety. However, studies on the migration characteristics and safety of copper‐based nanoparticle food packaging films are currently being conducted on plastic‐based films such as polyethylene, and research on bio‐based films is limited.