Optimizing Mutiple Quality Characteristics of Through Silicon Via(TSV) Interface and Solder Joint Interface by Numerical Analysis-based Taguchi Method-Reference-Cited by-同舟云学术

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Optimizing Mutiple Quality Characteristics of Through Silicon Via(TSV) Interface and Solder Joint Interface by Numerical Analysis-based Taguchi Method

Published:2011-06-30 Issue:3 Volume:29 Page:35-38
ISSN:1225-6153
Container-title:Journal of the Korean Welding and Joining Society
language:en
Short-container-title:Journal of the Korean Welding and Joining Society

Author:

Bang Han-Sur,Bang Hee-Seon,Park Se-Min,Lee Chang-Woo

Publisher

The Korean Welding and Joining Society

Link

http://ocean.kisti.re.kr/downfile/crosscheck/kws/JAKO201120956421882.pdf

Reference7 articles.

1. Thermal stresses in 3D IC inter-wafer interconnects

2. Numerical analysis of thermo-mechanical reliability of through silicon vias (TSVs) and solder interconnects in 3-dimensional integrated circuits

3. Estimation of warpage and thermal stress of IVHs in flip–chip ball grid arrays package by FEM

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