Author:
Cho Seunghyun,Cho Soonjin,Lee Joseph Y.
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference14 articles.
1. The printed circuit report. Prismark, 2004.
2. Wang B, Sun X, Fan QS, Yin Y. Numerical simulation of interface delamination in electronic packaging. In: Inter society conference on thermal phenomena, 2000. p. 400–4.
3. Investigation of thermomechanical behaviors of flip–chip BGA packages during manufacturing process and thermal cycling;Tsai;IEEE Trans Compon Pack Technol,2004
4. Characterization of chip scale package materials;Amagai;Microelectron Reliab,1999
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