Effect of Sintering Conditions on Microstructure and Mechanical Strength of Cu Micro-Particle Sintered Joints for High-Power Semiconductor Module Applications-Reference-Cited by-同舟云学术

Effect of Sintering Conditions on Microstructure and Mechanical Strength of Cu Micro-Particle Sintered Joints for High-Power Semiconductor Module Applications

Published:2019-04-30 Issue:2 Volume:37 Page:26-34
ISSN:2466-2232
Container-title:Journal of Welding and Joining
language:en
Short-container-title:Journal of Welding and Joining

Author:

Lee Byung-Suk,Back Jong-Hoon^ORCID,Yoon Jeong-Won^ORCID

Funder

Ministry of Trade, Industry and Energy

Publisher

The Korean Welding and Joining Society

Link

http://e-jwj.org/upload/jwj-37-2-26.pdf

Reference16 articles.

1. Power Module Packaging Technology with Extended Reliability for Electric Vehicle Applications

2. Reliability enhancement by integrated liquid cooling in power IGBT modules for hybrid and electric vehicles

3. Reliability design of direct liquid cooled power semiconductor module for hybrid and electric vehicles

4. Interfacial reactions and mechanical strength of Sn-3.0Ag-0.5Cu/Ni/Cu and Au-20Sn/Ni/Cu solder joints for power electronics applications

5. Lead-free Solder for Automotive Electronics and Reliability Evaluation of Solder Joint

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