Reliability design of direct liquid cooled power semiconductor module for hybrid and electric vehicles

Author:

Dai Xiaoping,Wang Yangang,Wu Yibo,Luo Haihui,Liu Guoyou,Li Daohui,Jones Steve

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference25 articles.

1. Reliability enhancement by integrated liquid cooling in power IGBT modules for hybrid and electric vehicles;Wang;Microelectron. Reliab.,2014

2. Higher Junction Temperature in Power Modules — A Demand from Hybrid Cars, a Potential for the Next Step Increase in Power Density for Various Variable Speed Drives;Bayerer,2008

3. High temperature power electronics IGBT modules for electrical and hybrid vehicles;John,2009

4. Small Size and High Thermal Conductivity IGBT Module for Automotive Applications;Nagaune,2011

5. New Compact-Package Power Modules for Electric and Hybrid Vehicles (J1 Series);Ishihara,2014

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