Interfacial reactions and mechanical strength of Sn-3.0Ag-0.5Cu/Ni/Cu and Au-20Sn/Ni/Cu solder joints for power electronics applications-Reference-Cited by-同舟云学术

Interfacial reactions and mechanical strength of Sn-3.0Ag-0.5Cu/Ni/Cu and Au-20Sn/Ni/Cu solder joints for power electronics applications

Published:2017-04 Issue: Volume:71 Page:119-125
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Lee Byung-Suk,Ko Yong-Ho,Bang Jung-Hwan,Lee Chang-Woo,Yoo Sehoon,Kim Jun-Ki,Yoon Jeong-Won

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

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4. Pb-free high temperature solders for power device packaging;Yamada;Microelectron. Reliab.,2006

5. Study of thermal cycling and temperature aging on PbSnAg die attach solder joints for high power modules;Dugal;Microelectron. Reliab.,2014

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3. Ceramic-to-metal bonding using rare-earth containing Sn–Bi solder;Journal of Materials Science: Materials in Electronics;2024-02

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5. Development of growth model on interfacial intermetallic compound at circular Cu/Sn3.5Ag interface;Journal of Materials Science: Materials in Electronics;2022-10-26