Experimental study on ductile-to-brittle behavior and crystal orientation in micro-crack induced severing of 4H-SiC and sapphire
Author:
Funder
National Natural Science Foundation of China
Publisher
Elsevier BV
Subject
Applied Mathematics,Mechanical Engineering,Condensed Matter Physics,General Materials Science
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1. Laser slicing of 4H-SiC wafers based on picosecond laser-induced micro-explosion via multiphoton processes;Optics & Laser Technology;2022-10
2. Analysis of the high-efficiency and low-damage abrasive processing mechanism for SiC based on the SPH simulation of single-grain indentation and scratching;AIP Advances;2022-05-01
3. Investigation of the Anisotropy of 4H-SiC Materials in Nanoindentation and Scratch Experiments;Materials;2022-03-28
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