Fixed Abrasive Diamond Wire Saw Slicing of Single-Crystal Silicon Carbide Wafers
Author:
Publisher
Informa UK Limited
Subject
Industrial and Manufacturing Engineering,Mechanical Engineering,Mechanics of Materials,General Materials Science
Link
http://www.tandfonline.com/doi/pdf/10.1081/AMP-120029960
Reference11 articles.
1. Fixed abrasive diamond wire machining—part I: process monitoring and wire tension force
2. Fixed abrasive diamond wire machining—part II: experiment design and results
3. Hardin, C.W. 2003. “Fixed-Abrasive Diamond Wire Saw Slicing of Single Crystal SiC Wafers and Wood”. North Carolina State University. MS thesis
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