Funder
Ministry of Education, Culture, Sports, Science and Technology
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference29 articles.
1. Recent progress in SLID bonding in novel 3D-IC technologies;Sun;J. Alloys Compd.,2020
2. Flexible electronic devices based on polymers;Peng,2017
3. Flexible Electronics: Materials and Applications;Tuller,2009
4. Substrates for flexible electronics: a practical investigation on the electrical, film flexibility, optical, temperature, and solvent resistance properties;Zardetto;J. Polym. Sci., Part B: Polym. Phys.,2011
5. Microstructure and mechanical properties of the In–48Sn–xAg low-temperature alloy;Le Han;J. Mater. Sci.,2020
Cited by
20 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献