Microstructure and mechanical properties of the In–48Sn–xAg low-temperature alloy
Author:
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Link
https://link.springer.com/content/pdf/10.1007/s10853-020-04691-7.pdf
Reference25 articles.
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3. Shen Y-A, Zhou S, Li J et al (2019) Sn–3.0Ag–0.5Cu/Sn–58Bi composite solder joint assembled using a low-temperature reflow process for PoP technology. Mater Des 183:108144. https://doi.org/10.1016/j.matdes.2019.108144
4. Shen YA, Zhou S, Li J et al (2019) Thermomigration induced microstructure and property changes in Sn–58Bi solders. Mater Des. https://doi.org/10.1016/j.matdes.2019.107619
5. Zhou S, Shen YA, Uresti T et al (2019) Improved mechanical properties induced by In and In & Zn double additions to eutectic Sn58Bi alloy. J Mater Sci: Mater Electron 30:7423–7434. https://doi.org/10.1007/s10854-019-01056-y
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