Effects of multiple reflows on microstructure and shear strength of (Au-20Sn)-2Ag/Au/Ni(P)/Kovar joints-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Effects of multiple reflows on microstructure and shear strength of (Au-20Sn)-2Ag/Au/Ni(P)/Kovar joints

Published:2020-06 Issue: Volume:788 Page:139568
ISSN:0921-5093
Container-title:Materials Science and Engineering: A
language:en
Short-container-title:Materials Science and Engineering: A

Author:

Chen Baishan,Huang Yufeng,Tang Siwei,Liu Wensheng,Ma Yunzhu

Funder

China Postdoctoral Science Foundation

Natural Science Foundation of Hunan Province, China

National Defense Pre-Research Foundation of China

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference40 articles.

1. A brief review on high-temperature, Pb-free die-attach materials;Zhang;J. Electron. Mater.,2018

2. Stability characterization of vacuum encapsulated MEMS resonators with Au-Sn solder bonding;Zhao;Microsyst. Technol.,2018

3. Superplastic creep of AuSn eutectic solder alloy;Elmer;Scripta Mater.,2016

4. Low cycle fatigue behavior of a eutectic 80Au/20Sn solder alloy;Jing;Int. J. Fatig.,2015

5. Controlling the microstructure from the gold-tin reaction;Tsai;J. Electron. Mater.,2005

Cited by 11 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Achieving outstanding mechanical property after long-cycle thermal shock of reflow/ultrasonic-assisted Kovar/SnSb10 interfaces;Materials Letters;2024-06

2. Influence of Nickel and Bismuth Addition on the Mechanical Shear Strength of SAC+ Ni, Bi Solders under Isothermal Aging and Multiple Reflows;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

3. Comparative study on the bonding property of laser and reflow soldered Sn-3.0Ag-0.5Cu/Ni–P microbumps after isothermal aging and multiple reflowing;Journal of Materials Research and Technology;2024-03

4. Dual-cluster interpretation of Au–Sn binary eutectics and solders;AIP Advances;2024-03-01

5. Effect of thermal exposure on microstructure, orientation relationship, residual stress and failure mechanism of ultrasonic-assisted Kovar/SnSb10/Kovar joints;Materials Characterization;2024-01

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号京ICP备18003416号-3