Dual-cluster interpretation of Au–Sn binary eutectics and solders
Author:
Affiliation:
1. College of Physical Science and Technology, Dalian University 1 , Dalian 116622, China
2. Key Laboratory for Materials Modification by Laser, Ion and Electron Beam (Dalian University of Technology), Ministry of Education 2 , Dalian 116024, China
Abstract
Funder
Dalian Youth Science and Technology Project
National Undergraduate Training Programs for Innovation and Entrepreneurship
Publisher
AIP Publishing
Link
https://pubs.aip.org/aip/adv/article-pdf/doi/10.1063/5.0192364/19708387/035010_1_5.0192364.pdf
Reference36 articles.
1. Au-Sn bonding material for the assembly of power integrated circuit module;J. Alloys Compd.,2016
2. Diffusion soldering: A new low temperature process for joining carat gold jewellery;Gold Bull.,1993
3. Kinetics of reactive diffusion between Au and Sn during annealing at solid-state temperatures;Mater. Sci. Eng.: A,2005
4. High-temperature creep and hardness of eutectic 80Au/20Sn solder;J. Alloys Compd.,2008
5. Interfacial microstructure evolution and shear behavior of Au–20Sn/(Sn)Cu solder joints bonded at 250 °C;Mater. Sci. Eng.: A,2016
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