Low cycle fatigue behavior of a eutectic 80Au/20Sn solder alloy

Author:

Jing H.Y.,Zhang Y.Y.,Xu L.Y.,Zhang G.S.,Han Y.D.,Wei J.

Funder

Key Project in the Science & Technology Pillar Program of Tianjin

Program for New Century Excellent Talents in University of China

Specialized Research Fund for the Doctoral Program of Higher Education of China

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Mechanical Engineering,Mechanics of Materials,General Materials Science,Modelling and Simulation

Reference38 articles.

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2. Zheng P, Wiggins A, Johnson RW, Frampton RV, Adam SJ, Peltz L. Die attach for high temperature electronics packaging. In: Proceedings of international high temperature electronics conference; 2008. p. 1–6.

3. Thermal stability characterization of the Au–Sn bonding for high-temperature applications;Rodriguez;IEEE Trans Comp Packag Manuf Technol,2013

4. High-power operation of highly reliable narrow stripe pseudomorphic single quantum well lasers emitting at 980nm;Larsson;IEEE Photon Technol Lett,1990

5. High-performance 980-nm quantum-well lasers using a hybrid material system of an Al-free InGaAs–InGaAsP active region and AlGaAs cladding layers grown by metal–organic chemical vapor deposition;Yang;IEEE J Quantum Electron,1999

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