Characterization of the shear test method with low melting point In–48Sn solder joints
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference24 articles.
1. Reliability issues for flip-chip packages
2. Power cycling thermal fatigue of Sn–Pb solder joints on a chip scale package
3. Reactions between Sn–Ag–Cu lead‐free solders and the Au/Ni surface finish in advanced electronic packages
4. Studies of the mechanical and electrical properties of lead-free solder joints
5. IMC Growth and Shear Strength of Sn-Ag-Bi-In/Au/Ni/Cu BGA Joints During Aging
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1. Effect of ZnO nanoparticle addition on the wettability, microstructure and mechanical properties of In-45.6Sn-5Bi low temperature solder;Journal of Materials Science;2024-08
2. CALPHAD-guided alloy design of Sn–In based solder joints with multiphase structure and their mechanical properties;Materials Science and Engineering: A;2022-12
3. Constitutive and damage model for the whole-life uniaxial ratcheting behavior of SAC305;Mechanics of Materials;2022-08
4. Effect of isothermal aging on properties of In-48Sn and In-Sn-8Cu alloys;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05
5. Effect of Ni foam addition on the microstructure and mechanical properties of In–48Sn eutectic alloy;Journal of Materials Science: Materials in Electronics;2022-04-27
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