Effect of isothermal aging on properties of In-48Sn and In-Sn-8Cu alloys-Reference-Cited by-同舟云学术

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Effect of isothermal aging on properties of In-48Sn and In-Sn-8Cu alloys

Published:2022-05 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
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Author:

Han Duy Le¹,Tatsumi Hiroaki¹,Huo Fupeng¹,Nishikawa Hiroshi¹

Affiliation:

1. Osaka University,Joining and Welding Research Institute,Osaka,Japan,567-0047

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9816066/9816372/09816402.pdf?arnumber=9816402

Reference29 articles.

1. Improvement in the mechanical properties of eutectic Sn58Bi alloy by 0.5 and 1 wt% Zn addition before and after thermal aging

2. Mechanical Properties and Solder Joint Reliability of Low-Melting Sn-Bi-Cu Lead Free Solder Alloy.

3. Effects of Indium Content on the Tensile Properties of Sn-Bi-In;omid,2015

4. Effect of silver (Ag) nanoparticle size on the microstructure and mechanical properties of Sn58Bi–Ag composite solders

5. Effects of a Third Element on Microstructure and Mechanical Properties of Eutectic Sn-Bi Solder

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Artifact-Free Microstructures in the Interfacial Reaction between Eutectic In-48Sn and Cu Using Ion Milling;Materials;2023-04-22

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