1. [1] Y. Ihara and A. Masuda, "Handbook on Mounting Technologies for Recent Electronic Parts and Devices," R&D planning, pp. 1141–1148, 2002.
2. [2] J. Hu, H. Tanaka, O. Munegata, T. Taguchi and T. Narita, "Study of Microstructure and Hardness of Sn–Bi Eutectic Alloy at Aging Treatment," 5th Symposium on "Microjoining and Assembly Technology in Electronics," pp. 409–414. 1999.
3. [3] K. Suganuma, T. Sakai and K. Kim, "Influence of Ag Addition to Sn–Bi Eutectic Alloy on Microstructure and on Mechanical Properties," Vol. 6, No. 5, pp. 414–419, 2003.
4. Significantly Improved Mechanical Properties of Bi- Sn Solder Alloys by Ag- Doping
5. [5] S. Sakuyama, T. Akamatsu, K. Uenishi and T. Sato, "Low Temperature Sn–Bi Soldering Technology for Low Stress Packaging," THE IEICE TRANSACTIONS ON ELECTRONICS, Vol. J91-C, No. 11, pp. 534–541, 2008.