Fluxless bonding of silicon to Ag-cladded copper using Sn-based alloys-Reference-Cited by-同舟云学术

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Fluxless bonding of silicon to Ag-cladded copper using Sn-based alloys

Published:2007-06 Issue:1-2 Volume:458 Page:116-122
ISSN:0921-5093
Container-title:Materials Science and Engineering: A
language:en
Short-container-title:Materials Science and Engineering: A

Author:

Kim Jong S.,Yokozuka Takehide,Lee Chin C.

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference15 articles.

1. Microelectronics Packaging Handbook;Tummala,1997

2. Printed Circuits Handbook,1995

3. Thermal expansion of reference materials: copper, silica and silicon

4. The Mechanics of Solder Alloy Interconnects,1994

5. Proceedings of the 52nd Electronic Components and Technology Conference;Beelen-Hendrikx,2002

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2. Effect of Process and Service Conditions on TLP-Bonded Components with (Ag,Ni–)Sn Interlayer Combinations;Journal of Electronic Materials;2015-08-28

3. Experimental characterization of the mechanical behavior of two solder alloys for high temperature power electronics applications;Microelectronics Reliability;2015-01

4. Fluxless eutectic bonding of GaAs-on-Si by using Ag/Sn solder;Electronic Materials Letters;2013-11

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