Thermal expansion of reference materials: copper, silica and silicon
Author:
Publisher
IOP Publishing
Subject
Surfaces, Coatings and Films,Acoustics and Ultrasonics,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Link
http://stacks.iop.org/0022-3727/6/i=17/a=313/pdf
Reference25 articles.
1. LXXXII. On the thermal expansion of solids at low temperatures
2. Lattice Constants and Thermal Expansivities of Silicon and of Calcium Fluoride between 6° and 322°K
3. An Experimental Study of the Absolute Temperature Scale VIII. The Thermal Expansion and Compressibility of Vitreous Silica and the Thermal Dilation of Mercury
4. Das thermische Ausdehnungsverhalten von Kieselgals als Funktion der thermischen Vorgeschichte
5. Thermal expansion of germanium and silicon at low temperatures
Cited by 190 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Configurable Add-Drop Filter With Stable Insertion Loss for X-Band Microwave Photonics;Journal of Lightwave Technology;2024-09-01
2. Thermal and structural evaluation of an asphalt pavement with an embedded inductive power transfer pad for stationary charging of EVs;Construction and Building Materials;2024-08
3. CALPHAD-based modeling of pressure-dependent Al, Cu and Li unary systems;Calphad;2024-06
4. Coupling conduction-band valleys in SiGe heterostructures via shear strain and Ge concentration oscillations;npj Quantum Information;2024-05-31
5. Mechanically induced optical loss mechanism due to thermal expansion coefficient mismatch in micro-cavities with all-around stressor layers;APL Photonics;2024-05-01
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3