Experimental characterization of the mechanical behavior of two solder alloys for high temperature power electronics applications-Reference-Cited by-同舟云学术

Experimental characterization of the mechanical behavior of two solder alloys for high temperature power electronics applications

Published:2015-01 Issue:1 Volume:55 Page:164-171
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Msolli S.,Alexis J.,Dalverny O.,Karama M.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

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