Roles of Cu in Pb-free solders jointed with electroless Ni(P) plating-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Roles of Cu in Pb-free solders jointed with electroless Ni(P) plating

Published:2013-07 Issue: Volume:574 Page:60-67
ISSN:0921-5093
Container-title:Materials Science and Engineering: A
language:en
Short-container-title:Materials Science and Engineering: A

Author:

Tseng Chien-Fu,Jill Lee Christine,Duh Jenq-Gong

Funder

Shenmao Technology Inc. and Kinsus Interconnect Technology Corporation

National Science Council, Taiwan

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference22 articles.

1. Lead-free Solders in Microelectronics

2. Physics and materials challenges for lead-free solders

3. Six cases of reliability study of Pb-free solder joints in electronic packaging technology

4. Tin–lead (SnPb) solder reaction in flip chip technology

5. Effect of thermal aging on the interfacial structure of SnAgCu solder joints on Cu

Cited by 27 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Bond shear strength of Al2O3 nanoparticles reinforced 2220-capacitor/SAC305 solder interconnects reflowed on bare and Ni-coated copper substrate;Journal of Materials Science: Materials in Electronics;2021-01-06

2. Interfacial microstructure evolution of solder joints by doping Cu nanoparticles into Ni(P) electroless plating;Journal of Materials Science: Materials in Electronics;2020-10-06

3. Performance and reliability of Al2O3 nanoparticles doped multicomponent Sn-3.0Ag-0.5Cu-Ni-Ge solder alloy;Microelectronics Reliability;2020-10

4. Development of low-silver content SAC0307 solder alloy with Al2O3 nanoparticles;Materials Science and Engineering: A;2020-06

5. Effects of Minor Cu, Ni and Ag Additions on the Reactions Between Sn-Based Solders and Co Substrate;JOM;2019-07-01

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号京ICP备18003416号-3