Interfacial microstructure evolution of solder joints by doping Cu nanoparticles into Ni(P) electroless plating-Reference-Cited by-同舟云学术

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Interfacial microstructure evolution of solder joints by doping Cu nanoparticles into Ni(P) electroless plating

Published:2020-10-06 Issue:22 Volume:31 Page:20232-20244
ISSN:0957-4522
Container-title:Journal of Materials Science: Materials in Electronics
language:en
Short-container-title:J Mater Sci: Mater Electron

Author:

Cheng Jinxuan,Zhang Jiankang,Liu Yi,Hu Xiaowu^ORCID,Zhang Zhe,Jiang Xiongxin

Funder

National Natural Science Foundation of China

Natural Science Foundation of Jiangxi Province

Outstanding Young talents funding of Jiangxi Province

The fund of the State Key Laboratory of Advanced Technologies for Comprehensive Utilization of Platinum Metals

Publisher

Springer Science and Business Media LLC

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Link

https://link.springer.com/content/pdf/10.1007/s10854-020-04543-9.pdf

Reference46 articles.

1. H. He, H. Zhao, F. Guo, G. Xu, Bi layer formation at the anode interface in Cu/Sn–58Bi/Cu solder joints with high current density. J. Mater. Sci. Technol. 28, 46–52 (2012)

2. Y.-W. Yen, R.-S. Syu, C.-M. Chen, C.-C. Jao, G.-D. Chen, Interfacial reactions of Sn–58Bi and Sn–0.7Cu lead-free solders with Alloy 42 substrate. Microelectron. Reliab. 54, 233–238 (2014)

3. X. Chen, J. Zhou, F. Xue, Y. Yao, Mechanical deformation behavior and mechanism of Sn–58Bi solder alloys under different temperatures and strain rates. Mater. Sci. Eng.: A 662, 251–257 (2016)

4. G. Chen, X.H. Wang, J. Yang, W.L. Xu, Q. Lin, Effect of micromorphology on corrosion and mechanical properties of SAC305 lead-free solders. Microelectron. Reliab. 108, 113634 (2020)

5. T. Lu, D. Yi, H. Wang, X. Tu, B. Wang, Microstructure, mechanical properties, and interfacial reaction with Cu substrate of Zr-modified SAC305 solder alloy. J. Alloys Compd. 781, 633–643 (2019)

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