Influence of microstructure on quasi-static and dynamic mechanical properties of bismuth-containing lead-free solder alloys
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference30 articles.
1. Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys
2. Ag3Sn plate formation in the solidification of near-ternary eutectic Sn-Ag-Cu
3. Microstructure and mechanical properties of lead-free solders and solder joints used in microelectronic applications
4. A review of mechanical properties of lead-free solders for electronic packaging
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5. Enhancement of Thermal cycle and Drop Shock Reliability at Board Level with Developed Solder Composition by Optimized Bi, Cu, Ni Contents in Lead Free Solder Composition;2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT);2023-10-25
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