Ag3Sn plate formation in the solidification of near-ternary eutectic Sn-Ag-Cu-Reference-Cited by-同舟云学术

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Ag3Sn plate formation in the solidification of near-ternary eutectic Sn-Ag-Cu

Published:2003-06 Issue:6 Volume:55 Page:61-65
ISSN:1047-4838
Container-title:JOM
language:en
Short-container-title:JOM

Author:

Kang Sung K.,Shih Da-Yuan,Donald NY.,Henderson W.,Gosselin Timothy,Sarkhel Amit,Charles Goldsmith NY.,Puttlitz Karl J.,Choi Won Kyoung

Publisher

Springer Science and Business Media LLC

Subject

General Engineering,General Materials Science

Link

http://link.springer.com/content/pdf/10.1007/s11837-003-0143-6.pdf

Reference13 articles.

1. C.M. Miller, I.E. Anderson, and J.F. Smith, “A Viable Tin-Lead Solder Substitute: Sn-Ag-Cu,” J. Electronic Materials, 23 (7) (1994), pp. 595–601.

2. I.E. Anderson et al., “Alloying Effects in Near-Eutectic Sn-Ag-Cu Solder Alloys for Improved Microstructural Stability,” J. Electronic Materials, 30 (9) (2001), pp. 1050–1059.

3. K.W. Moon et al., “Experimental and Thermodynamic Assessment of Sn-Ag-Cu Solder Alloys,” J. Electronic Materials, 29 (10) (2000), p. 1122.

4. M.E. Loomans and M.E. Fine, Metall. Mater. Trans. A, Phys. Metall. Mater. Sci., 31A (4) (2000), p. 1155.

5. J. Bartelo et al., Proc. APEX 2001 (Northbook, IL: ILF-2, 2001).

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