Interface reactions between 50In–50Pb solder and electroplated Au layers
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference15 articles.
1. Soldering Handbook;Vianco,2000
2. Layer growth in Au-Pb/In solder joints
3. P. Vianco, J. Rejent, Sandia National Laboratories, unpublished data.
4. Metallography of Au-InPb Diffusion Couples and Electronic Components Soldered with InPb Alloys / Metallographie von Au-InPb-Diffusionspaaren und von elektronischen Bauteilen mit InPb-Lötungen
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