Impact of Gold Thickness on Interfacial Evolution and Subsequent Embrittlement of Tin–Lead Solder Joints-Reference-Cited by-同舟云学术

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Impact of Gold Thickness on Interfacial Evolution and Subsequent Embrittlement of Tin–Lead Solder Joints

Published:2022-09-20 Issue:12 Volume:51 Page:7337-7352
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:J. Electron. Mater.

Author:

Wheeling Rebecca^ORCID,Vianco Paul,Williams Shelley,Jauregui Luis,Gallis Dorina F. Sava

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

https://link.springer.com/content/pdf/10.1007/s11664-022-09891-2.pdf

Reference22 articles.

1. P. Vianco, Soldering Handbook, 3rd ed., (Miami: American Welding Society, 1999).

2. M. Wolverton, in IPC APEX EXPO Conference Proceedings, 2015.

3. P. Vianco, A Review of Interface Microstructures in Electronic Packaging Applications: Soldering Technology. J. Mater. 71, 1 (2018).

4. D. Crowe, A. Feinberg, Design for Reliability, 1st edn. (CRC Press, 2001)

5. M.H. Bester, in International Electronics Packaging and Production Conference Proceedings (1968), p. 211

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. The Effect of Thermal Aging on the Mechanical Properties of Gold-Containing Solder Joints;Journal of Electronic Materials;2024-06-28

2. Inversion for Thermal Properties with Frequency Domain Thermoreflectance;ACS Applied Materials & Interfaces;2024-01-09

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