Inversion for Thermal Properties with Frequency Domain Thermoreflectance

Author:

Treweek Benjamin1ORCID,Akcelik Volkan1,Hodges Wyatt1ORCID,Jarzembski Amun1,Bahr Matthew1,Jordan Matthew1,McDonald Anthony1,Yates Luke1,Walsh Timothy1,Pickrell Gregory1ORCID

Affiliation:

1. Sandia National Laboratories, Albuquerque, New Mexico 87123, United States

Funder

Sandia National Laboratories

Publisher

American Chemical Society (ACS)

Reference43 articles.

1. Wesling, P. HIR Overview and Executive Summary. Heterogeneous Integration Roadmap Edition 2019, 2019; pp 1–14.

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3. Wesling, P. Reliability. Heterogeneous Integration Roadmap Edition 2021, 2021; pp 1–30.

4. Initial thermal stress and strain effects on thermal mechanical stability of through silicon via

5. Impact of Gold Thickness on Interfacial Evolution and Subsequent Embrittlement of Tin–Lead Solder Joints

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