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2. P. Vianco, Understanding the Reliability of Solder Joints Used in Advanced Structural and Electronics Applications: Part 1, Filler Metal Properties and the Soldering Process. Welding J. Res. Supp. 96, 39 (2017).
3. P. Vianco, A Review of Interface Microstructures in Electronic Packaging Applications: Soldering Technology. J. Metals 71, 158 (2019).
4. P. Vianco, An Overview of Surface Finishes and Their Role in Printed Circuit Board Solderability and Solder Joint Performance. Circuit World 25, 6 (1998).
5. T. Massalski, Binary Alloy Phase Diagram (Materials Park: ASM, 1987, p. 315).