Interface Embrittlement Between 63Sn-37Pb Solder and Au Layer—Part 1: Physical Metallurgy of Liquid-State and Solid-State Reactions-Reference-Cited by-同舟云学术

Interface Embrittlement Between 63Sn-37Pb Solder and Au Layer—Part 1: Physical Metallurgy of Liquid-State and Solid-State Reactions

Published:2022-08-30 Issue:11 Volume:51 Page:6431-6453
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:J. Electron. Mater.

Author:

Vianco P. T.,Kilgo A. C.,McKenzie B. M.,Grant R. L.,Williams S.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

https://link.springer.com/content/pdf/10.1007/s11664-022-09880-5.pdf

Reference12 articles.

1. P.T. Vianco, Soldering Handbook, 3rd ed., (Miami, FL: American Welding Society, 2000), p. 24.

2. P. Vianco, Understanding the Reliability of Solder Joints Used in Advanced Structural AND Electronics Applications: Part 1, Filler Metal Properties and the Soldering Process. Welding J. Res. Supp. 96, 39s (2017).

3. P. Vianco, A Review of Interface Microstructures in Electronic Packaging Applications: Soldering Technology. J. Metals 71, 158 (2019).

4. P. Vianco, An Overview of Surface Finishes and Their Role in Printed Circuit Board Solderability and Solder Joint Performance. Circuit World 25, 6 (1998).

5. M. Bester, Proc. Inter NEPCON (1968), p. 211.

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