Tensile fracture of tin–lead solder joints in copper-Reference-Cited by-同舟云学术

Tensile fracture of tin–lead solder joints in copper

Published:2004-08 Issue:1-2 Volume:379 Page:277-285
ISSN:0921-5093
Container-title:Materials Science and Engineering: A
language:en
Short-container-title:Materials Science and Engineering: A

Author:

Prakash K.H.,Sritharan T.

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference19 articles.

1. An Experimental Study of Electrohydrodynamic Induction Pumping of a Stratified Liquid/Vapor Medium

2. H. Akay, H. Zhang, N. Paydar, in: Advances in Electronic Packaging, Proceedings of the Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference, INTERpack’97, vol. 2, 1997, p. 1583.

3. Solder joint fatigue models: review and applicability to chip scale packages

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