Computational Modeling of Intergranular Crack Propagation in燼n營ntermetallic Compound Layer
Author:
Publisher
Computers, Materials and Continua (Tech Science Press)
Subject
Computer Science Applications,Modeling and Simulation,Software
Reference43 articles.
1. Study of fracture mechanics in testing interfacial fracture of solder joints;Bang;Journal of Electronic Materials,2008
2. Simulation of dynamic fracture along solder-pad interfaces using a cohesive zone model;Jing;Engineering Failure Analysis,2009
3. Fracture mechanics analysis of solder joint intermetallic compounds in shear test;Alam;Computational Materials Science,2009
4. A grain level model for the study of failure initiation and evolution in polycrystalline brittle materials. Part I: Theory and numerical implementation;Zavattieri;Mechanics of Materials,2003
5. A grain level model for the study of failure initiation and evolution in polycrystalline brittle materials. Part II: Numerical examples;Zavattieri;Mechanics of Materials,2003
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