Study on Interfacial Reactions and Tensile Properties in the Sn/C1990 HP Systems-Reference-Cited by-同舟云学术

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Study on Interfacial Reactions and Tensile Properties in the Sn/C1990 HP Systems

Published:2022-10-26 Issue: Volume: Page:
ISSN:
Container-title:2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
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Author:

Laksono Andromeda Dwi¹,Chou Jing-Ting¹,Chiang Tzu-Yang¹,Yen Yee-Wen¹

Affiliation:

1. National Taiwan University of Science and Technology,Department of Materials Science and Engineering,Taipei,Taiwan, R.O.C,10672

Funder

Ministry of Science and Technology

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9966654/9966628/09966668.pdf?arnumber=9966668

Reference31 articles.

1. Interfacial reactions and mechanical properties between Sn–4.0Ag–0.5Cu and Sn–4.0Ag–0.5Cu–0.05Ni–0.01Ge lead-free solders with the Au/Ni/Cu substrate

2. Microstructure, kinetic analysis and hardness of Sn–Ag–Cu–1wt% nano-ZrO2 composite solder on OSP-Cu pads

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Interfacial reactions in the Sn-9.0 wt.% Zn/Cu-Ti alloy (C1990 HP) couple;Soldering & Surface Mount Technology;2023-09-19

2. Investigation of the Sn-0.7 wt.% Cu Solder Reacting with C194, Alloy 25, and C1990 HP Substrates;Metals;2022-12-21

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